RO4350B PCB Manufacturing Planning

A manufacturable RF PCB begins with a controlled release package. The laminate name alone does not define impedance, loss, finished thickness or acceptance.

Before fabrication

Provide fabrication data, drill data, a readable drawing and the netlist where available. Resolve differences between filenames, revision notes and the drawing before production starts. Identify the controlled-impedance nets and the reference planes used by each structure.

Stackup approval

Document each core and bonding layer, the finished dielectric spacing, foil type and finished copper. Ask the fabricator to review available materials and proposed etch compensation. Preserve the agreed stackup with the released revision.

Process review

Review drilling, hole preparation, plating, registration, routing and surface finish in the context of the board geometry. Exact operating parameters belong to a qualified manufacturing process; a generic online recipe is not an adequate production instruction.

Inspection and evidence

Agree which dimensions and electrical characteristics will be measured, the coupon design, the sampling approach and the records delivered with the lot. See the acceptance planning guide.